
				INA826EVM Fab Data



Notes:

1) BOARD FILE DESCRITPTONS

	FILENAME			DESCRIPTION			COPPER LAYER SEQUENCE
 
	*.top  			Top Layer Copper				1
	
	*.bot				Bottom Layer Copper			2

	*.sst				Top Silk Overlay

	*.ssb				Bottom Silk Overlay

	*.smt				Top Solder Mask

	*.smb				Bottom Solder Mask

	*.gtp				Top Paste

	*.gd1				Drill Drawing

	*.drl				NC Drill Data in ASCII format

	*.ipc				Test Point File

	*.adt				Assembly Notes

	*.txt				ASCII Pick and Place

	INA826EVM Fab Data.TXT	This File

2) PWB TO BE MANUFACTURED RoHS COMPLIANT AND
   
MARKED AS PER IPC-1066.



3) PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012,

   CLASS 2 STANDARDS AND WORKMANSHIP SHALL CONFORM

   TO IPC-A-600, CLASS 2 - CURRENT REVISIONS.



4) BOARD MATERIAL AND CONSTRUCTION TO BE UL
   
APPROVED AND MARKED ON THE FINISHED BOARD.



5) LAMINATE MATERIAL: COPPER-CLAD FR-4 HIGH Tg MATERIAL;
   
Tg >= 175 DEGREES C, Td >= 350 DEGREES C.



6) COPPER WEIGHT: 1oz FINISHED, ALL LAYERS



7) FINISHED THICKNESS: .062 +/- .010



8) MIN PLATING THICKNESS IN THROUGH HOLES: .001"



9) BOARD FINISH: ENIG



10) LPI SOLDERMASK BOTH SIDES USING APPROPRIATE

    LAYER ARTWORK:  COLOR = GREEN



11) LPI SILKSCREEN AS REQUIRED:  COLOR - WHITE



12) VENDER INFORMATION TO BE INCORPORATED
    
	ON BACK SIDE WHENEVER POSSIBLE



13) MINIMUM COPPER CONDUCTOR WIDTH IS: 10 MILS

	MINIMUM CONDUCTOR SPACING IS: 7 MILS



14) NUMBER OF FINISHED LAYERS: 2



15) BOARD DIMENSIONS: 3.6 IN. X 2.3 IN.